B.E. Electrical Engineering:Microelectronics TechnologyThapar University
Price on request
First Year: Semester I
First Year: Semester-II
Electrical and Electronic Science
Second Year- Semester - I
Measurement Science and Techniques
Digital Electronic Circuits
Electromechanical Energy conversion
Human Values, Ethics and IPR
Second Year- Semester – II
Numerical and Statistical Methods
Power Generation and Economics
Analog Electronic Circuits
Electrical and Electronic Measurements
Transmission and Distribution of Power
Third Year- Semester – I
Switch gear and Protection
Summer Training (6 Weeks after 2nd year during summer vacation)
Third Year- Semester – II
Total Quality Management
Power System Analysis
Flexible AC Transmission Systems
Fourth Year- Semester – I
High Voltage Engineering
Operation and Control of Power Systems
Intelligent Algorithms in Power Systems
Fourth Year- Semester – II
Integrated Circuits: Introduction and advantages, effects of ICs on industry, scales of integration. Hybrid , Monolithic and ICs, VLSI, ULSI.
Growth of Single Crystals of Silicon: Growth from melt using Czochralski?s method, Intrinsic and doped single crystals. Zone refining. Epitaxial layer growth. Types of epitaxy: VPE, MBE, MOCVD, Defects in epitaxial layers and their removal.
Wafer preparation: Shaping operations, surface grinding, slicing, lapping, etching, polishing.
Fabrication Processes: Diffusion: Impurity diffusion in a semiconductor crystal. Fick?s Laws, Gaussian and Complementary Error Function Distribution of Impurities. Design of junction diode, transistor, FET and MOSFETs., ion-implantation Oxidation, plasma oxidation, Lithography ; Photolithography, Ebeam x-ray and ion beam lithography, etching dry and wet and metalization.
Packaging of ICs: Wafer probing, dicing, die mounting, wire bounding, Mountings in packages using Dual-inl-line (DIP) or TO packages. Packages using surface-mount-technology (SMT),
Computer aided Testing: Testing & Techniques.
MOS & CMOS Technology: Polysilicon gates and Well structures.
Recent Trends in Technology & Packaging VLSI Assembly Technology