B.E. Electronics & Comm. Engg:Micro Electro Mechanical Systems (MEMS)

Thapar University
In Patiala

Price on request
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Important information

  • Bachelor
  • Patiala

Important information

Where and when

Starts Location
On request
Thapar University P.O Box 32, 147004, Punjab, India
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Course programme

First Year: Semester I

Mathematics I
Engineering graphics
Computer Programming
Solid Mechanics
Communication Skills

First year: Semester II

Mathematics II
Manufacturing Process
Electrical and Electronic Science
Organizational Behavior

Second year: Semester I

Numerical and Statistical Methods
Measurement Science and Techniques
Electromagnetic Fields
Semiconductor Devices
Signals and Systems
Digital Electronic Circuits
Human Values, Ethics and IPR

Second year: Semester II

Optimization Techniques
Analog Electronic Circuits
Networks and Transmission Lines
Electrical Engineering Materials
Analog Communication Systems
Data Structure and Information Technology
Environmental Studies

Third year: Semester I

Digital Signal Processing for Communications Microprocessors
VLSI Circuit Design
Digital Communication Systems
Microelectronics Technology
Linear Integrated Circuits and Applications
Summer Training(6 weeks)

Third year: Semester II

Project Semester
Industrial Training(6 weeks)

Fourth year: Semester I

Antenna and Wave Propagation
Modern Control Engineering
Wireless and Mobile Communication Systems
Microwave Engineering
Engineering Economics

Fourth year: Semester II

Optical Communication Systems
Advanced Communication Systems
HDL Based Digital Design
Total Quality Management
Minor Project

Micro Electro Mechanical Systems (MEMS)

MEMS Overview: Unique Characteristics of MEMS, , Examples of MEMS, Future Directions of MEMS.

MEMS Fabrication: MEMS materials and fabrication methods, with emphasis on silicon micromachining, basic MEMS device concepts including pressure, acceleration, rotation and flow sensors, as well as more advanced devices, systems and applications, MEMS device design and simulation tools, MEMS device measurement and characterization principles and techniques, and MEMS packaging concepts.

MEMS Solutions for Data Storage: Technical Rationale, HexSil Linear Actuator, V-HARM, and other Technologies

MEMS Flexures: Overview, Technical Rationale, Examples, Optimal Design, Basic Flexure Types: Hammock, Crab-leg and Double-folded, Stress Analysis, Flexible Design Method, Unified Beam Bending Theory. Typical Application Areas of MEMS.

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